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STPS30L60C
Power Schottky rectifier
Main product characteristics
IF(AV) VRRM Tj (max) VF (max) 2 x 15 A 60 V 150 C 0.56 V
A1 K A2
A2 K A1
TO-220FPAB STPS30L60CFP
Features and benefits

Low forward voltage drop Negligible switching losses Low thermal resistance Avalanche capability specified
K A1 A1 A2 K A2
Description
Dual center tap Schottky rectifiers suited for switched mode power supplies and high frequency DC to DC converters. Packaged in TO-220FPAB, TO-220, D2PAK, I2PAK and TO-247, this device is intended for use in high frequency inverters.
TO-220AB STPS30L60CT
I2PAK STPS30L60CR
K
A2 A1 K A1 A2
D2PAK STPS30L60CG
TO-247 STPS30L60CW
Order codes
Part Number STPS30L60CW STPS30L60CT STPS30L60CG STPS30L60CG-TR STPS30L60CR STPS30L60CFP Marking STPS30L60CW STPS30L60CT STPS30L60CG STPS30L60CG STPS30L60CR STPS30L60CFP
March 2007
Rev 7
1/11
www.st.com 11
Characteristics
STPS30L60C
1
Characteristics
Table 1.
Symbol VRRM IF(RMS)
Absolute ratings (limiting values, per diode)
Parameter Repetitive peak reverse voltage RMS forward current Average forward current TO-220AB = 0.5 TO-220FPAB = 0.5 TC = 130 C TC = 110 C Per diode Per device Per diode Per device Value 60 30 15 30 15 30 230 2 7800 -65 to + 175 temperature(1) 150 10000 Unit V A
IF(AV)
A
IFSM IRRM PARM Tstg Tj dV/dt
1.
dPtot --------------dTj
Surge non repetitive forward current Repetitive peak reverse current Repetitive peak avalanche power Storage temperature range Maximum operating junction <
1 ------------------------Rth ( j - a )
tp = 10 ms Sinusoidal tp = 2 s square F = 1 kHz tp = 1 s Tj = 25 C
A A W C C V/s
Critical rate of rise reverse voltage
condition to avoid thermal runaway condition for a diode on its own heatsink
Table 2.
Symbol
Thermal resistances
Parameter TO-220AB, I2PAK, D2PAK, TO-247 Per diode Total Per diode Total Value 1.5 0.8 4.7 3.95 0.1 3.2 C/W Unit
Rth(j-c)
Junction to case TO-220FPAB
Rth(c)
Coupling
TO-220AB, I2PAK, D2PAK, TO-247 TO-220FPAB
When the diodes 1 and 2 are used simultaneously : Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) Table 3.
Symbol IR (1)
Static electrical characteristics (per diode)
Parameter Reverse leakage current Tests Conditions Tj = 25 C Tj = 125 C Tj = 25 C IF = 15 A IF = 15 A IF = 30 A IF = 30 A 0.65 0.5 VR = VRRM Min. Typ. Max. 480 77 130 0.6 0.56 V 0.75 0.7 Unit A mA
VF (1)
Forward voltage drop
Tj = 125 C Tj = 25 C Tj = 125 C
1. Pulse test : tp = 380 s, < 2%
To evaluate the conduction losses use the following equation : P = 0.42 x IF(AV) + 0.009x IF2(RMS)
2/11
STPS30L60C
Characteristics
Figure 1.
Average forward power dissipation Figure 2. versus average forward current (per diode)
18
= 0.1 = 0.05 = 0.2 = 0.5 =1
Average forward current versus ambient temperature ( = 0.5, per diode)
Rth(j-a)=Rth(j-c)
12 10 8 6 4 2
PF(av)(W)
IF(av)(A)
16 14 12
TO-220FPAB
10 8 6
T
Rth(j-a)=15 C/W
4
T
IF(av) (A) 0 0 2 4 6 8 10 12 14
=tp/T
tp
2
=tp/T
0 25
tp
Tamb(C)
50 75 100 125 150
16
18
20
0
Figure 3.
Normalized avalanche power derating versus pulse duration
Figure 4.
Normalized avalanche power derating versus junction temperature
PARM(tp) PARM(1s)
1
1.2 1
PARM(tp) PARM(25C)
0.1
0.8 0.6
0.01
0.4 0.2
0.001
0.01 0.1 1
tp(s)
10 100 1000
Tj(C)
0 0 25 50 75 100 125 150
Figure 5.
Non repetitive surge peak forward Figure 6. current versus overload duration (maximum values, per diode) (TO-220AB, TO-247, D2PAK, I2PAK)
120
Non repetitive surge peak forward current versus overload duration (maximum values, per diode) (TO-220FPAB)
TO-220FPAB
250 200
IM(A)
IM(A)
100
80
150
Tc=25C
TC=50 C
60
100 50
IM t
Tc=75C
40
Tc=125C
TC=75 C
IM t
20
0 1E-3
=0.5
t(s) 1E-2 1E-1 1E+0
0 1.E-03
=0.5
t(s)
1.E-02 1.E-01
TC=125 C
1.E+00
3/11
Characteristics
STPS30L60C
Figure 7.
Figure 8. Relative variation of thermal impedance junction to case versus pulse duration (TO-220AB, TO-247, D2PAK, I2PAK)
1.0 0.9
Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAB)
Zth(j-c)/Rth(j-c)
1.0 0.8 0.6 0.4 0.2
Zth(j-c)/Rth(j-c)
TO-220FPAB
0.8 0.7
= 0.5
0.6 0.5
=0.5
= 0.2 = 0.1
0.4 0.3 0.2
=0.2 =0.1
T
Single pulse
tp(s) 1E-3 1E-2 1E-1 1E+0
0.0 1E-4
0.1
Single pulse
tp(s)
1.E-01
=tp/T
1.E+00
tp
0.0 1.E-03 1.E-02 1.E+01
Figure 9.
Reverse leakage current versus reverse voltage applied (typical values, per diode)
Figure 10. Junction capacitance versus reverse voltage applied (typical values, per diode)
C(nF) 2.0
5E+2 1E+2 1E+1 1E+0
IR(mA)
Tj=150C Tj=125C Tj=100C
F=1MHz Tj=25C
1.0 0.5
Tj=75C Tj=50C
1E-1 1E-2
Tj=25C
0.2
VR(V) 0 5 10 15 20 25 30 35 40 45 50 55 60
VR(V) 0.1 1 10 100
Figure 11. Forward voltage drop versus forward current (maximum values, per diode)
Figure 12. Thermal resistance junction to ambient versus copper surface under tab for D2PAK (Epoxy printed circuit board FR4, copper thickness: 35 m)
Rth(j-a)(C/W)
80 70
200 100
IFM(A)
Typical values Tj=150C Tj=25C
60 50 40
10
30
Tj=125C
20
VFM(V) 1 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50
10
S(cm)
0 0 5 10 15 20 25 30 35 40
4/11
STPS30L60C
Package information
2
Package information

Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 Nm Maximum torque value: 1.0 Nm TO-220FPAB dimensions
Dimensions Ref. Millimeters Min. A
A H B
Table 4.
Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.067 0.205 0.106 0.409
Max. 4.6 2.7 2.75 0.70 1 1.70 1.70 5.20 2.7 10.4
4.4 2.5 2.5 0.45 0.75 1.15 1.15 4.95 2.4 10
B D E
Dia L6 L2 L3 L5 F1 L4 F2 D L7
F F1 F2 G G1 H L2
E
16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20
0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126
F G1 G
L3 L4 L5 L6 L7 Dia.
5/11
Package information Table 5. TO-220AB dimensions
STPS30L60C
Dimensions Ref Millimeters Min. A
H2 Dia L5 L7 L6 L2 F2 F1 L9 L4 F G1 G M E D C A
Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.044 0.194 0.094 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.066 0.202 0.106 0.409
Max. 4.60 1.32 2.72 0.70 0.88 1.70 1.70 5.15 2.70 10.40
4.40 1.23 2.40 0.49 0.61 1.14 1.14 4.95 2.40 10
C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam.
16.4 typ. 13 2.65 15.25 6.20 3.50 14 2.95 15.75 6.60 3.93
0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154
2.6 typ. 3.75 3.85
0.102 typ. 0.147 0.151
6/11
STPS30L60C Table 6. D2PAK dimensions
Package information
DIMENSIONS REF. Millimeters Min. A
A E L2
Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126
Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20
4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40
A1
C2
A2 B
D
L L3 A1 B2 B G A2
B2 C C2
C R
D E G L
M
*
V2
L2 L3 M R V2
* FLAT ZONE NO LESS THAN 2mm
0.40 typ. 0 8
0.016 typ. 0 8
Figure 13. Footprint (dimensions in millimeters)
16.90
10.30 1.30
5.08
8.90
3.70
7/11
Package information Table 7. I2PAK dimensions
STPS30L60C
Dimensions Ref. Millimeters Min.
A E L2 c2
Inches Min. 0.173 0.094 0.024 0.044 0.019 0.048 0.352 0.094 0.195 0.394 0.512 0.138 0.050 Max. 0.181 0.107 0.035 0.067 0.028 0.052 0.368 0.106 0.203 0.409 0.551 0.155 0.055
Max. 4.60 2.72 0.88 1.70 0.70 1.32 9.35 2.70 5.15 10.40 14 3.93 1.40
A A1 b b1
4.40 2.40 0.61 1.14 0.49 1.23 8.95 2.40 4.95 10 13 3.50 1.27
D
c c2
L1 L b1
A1
D e e1 E
b e e1
c
L L1 L2
8/11
STPS30L60C Table 8. TO-247 dimensions
Package information
DIMENSIONS REF. Millimeters Min. A
V
Inches Min. 0.191 0.086 0.015 0.039 0.118 0.078 Typ. Max. 0.203 0.102 0.031 0.055
Typ.
Max. 5.15 2.60 0.80 1.40
4.85 2.20 0.40 1.00 3.00 2.00 2.00 3.00 10.90 15.45 19.85 3.70 18.50 14.20 34.60 5.50 2.00 5 60 3.55
D E
V
Dia
F F1
H
A
F2 F3
2.40 3.40
0.078 0.118 0.429
0.094 0.133
L5 L L2 L4 F1 V2 F(x3) M G E F2 F3 F4 L3 D L1
F4 G H L L1 L2 L3 L4 L5 M V V2 Dia.
15.75 0.608 20.15 0.781 4.30 0.145 0.728 14.80 0.559 1.362 0.216 3.00 0.078 5 60 3.65 0.139
0.620 0.793 0.169
0.582
0.118
0.143
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
9/11
Ordering information
STPS30L60C
3
Ordering information
Ordering code STPS30L60CW STPS30L60CT STPS30L60CG STPS30L60CG-TR STPS30L60CR STPS30L60CFP Marking STPS30L60CW STPS30L60CT STPS30L60CG STPS30L60CG STPS30L60CR STPS30L60CFP Package TO-247 TO-220AB D2PAK D PAK I PAK TO-220FPAB
2 2
Weight 4.4 g 2.3 g 1.5 g 1.5 g 1.49 g 2.0 g
Base qty 50 50 50 1000 50 50
Delivery mode Tube Tube Tube Tape and reel Tube Tube
4
Revision history
Date July-2003 16-Oct-2006 28-Nov-2006 07-Mar-2007 31-Mar-2007 Revision 3B 4 5 6 7 Initial release Reformatted to current standards. Corrected dimensions for I2PAK in Table 5. Added TO-220FPAB package. Added STPS30L60CG-TR to ordering information. Updated thermal parameters in Table 2. Updated TC = 110 C in Table 1. Description of Changes
10/11
STPS30L60C
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